Thriving SparkLink Ecosystem
Standards and Technology Leading the Future
In his address, Secretary-General Zeng first reviewed the strong momentum of the SparkLink industrial ecosystem. To date, the Alliance has grown to over 1,200 members and 54 developer partners, established 3 authorized innovation labs, and enabled the launch of 20+ commercial chips and 200+ certified products. Cumulative chip shipments reached 85 million units in 2024, with 2025 shipments projected to exceed 100 million units.
SparkLink products have expanded from early low-power data transmission (e.g., keyboards, mice, styluses) to high-precision positioning (e.g., digital car keys, directional remotes). An explosion of new audio and sensor products is expected in the second half of 2025.
Regarding standardization:
The SparkLink SLE (SparkLink Low Energy) national standard is set for official release this year....
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Zeng Guosong, Secretary-General of the International SparkLink Alliance, delivered a keynote speech titled "Empowering Developers, Enriching the Spark Ecosystem." He comprehensively shared progress in the SparkLink industrial ecosystem and standardization efforts, with a focus on unveiling a new 2025 developer empowerment plan. The speech outlined a clear blueprint for deep integration between SparkLink technology and the HarmonyOS ecosystem.
Thriving SparkLink Ecosystem
Standards and Technology Leading the Future
In his address, Secretary-General Zeng first reviewed the strong momentum of the SparkLink industrial ecosystem. To date, the Alliance has grown to over 1,200 members and 54 developer partners, established 3 authorized innovation labs, and enabled the launch of 20+ commercial chips and 200+ certified products. Cumulative chip shipments reached 85 million units in 2024, with 2025 shipments projected to exceed 100 million units.
SparkLink products have expanded from early low-power data transmission (e.g., keyboards, mice, styluses) to high-precision positioning (e.g., digital car keys, directional remotes). An explosion of new audio and sensor products is expected in the second half of 2025.
Regarding standardization:
- The SparkLink SLE (SparkLink Low Energy) national standard is set for official release this year.
- SparkLink SLB (SparkLink Basic)-powered "*Technical Requirements and Test Methods for 360-Degree Surround View Systems in Commercial Vehicles*" is currently the only wireless technology meeting multi-channel HD video transmission requirements. This standard has been adopted as an industry standard by the Ministry of Transport, with national standardization underway.
- SparkLink has also been integrated into remote control standards by the National Radio and Television Administration and the China Video Industry Association.
- The Alliance is collaborating with members to advance a national standard for SparkLink-based digital car keys.
"Action" Yields Fruit
Incentive Plan Upgraded
Empowering developers remains a top Alliance priority. Secretary-General Zeng highlighted the 2024 "Action" initiative, which attracted 20+ leading enterprises, incubated 20+ chips, 100+ modules, and 40+ development boards, establishing a diverse hardware ecosystem. On the software foundation, NearLink Kit and deep integration with OpenHarmony provide developers with rapid development capabilities and extensive application support.
To accelerate ecosystem growth in 2025, the Alliance announced an upgraded "Action" program, introducing unprecedented incentives across 9 key areas:
- Chip Core IP Support: Encouraging open sharing of core chip IP.
- Code Contribution Incentives: Rewarding developers for substantive code contributions to SparkLink’s open-source community.
- Developer Enablement: Supporting training, technical documentation, and foundational resources.
- Interoperability Development Tools: Funding tools for efficient cross-device testing and development.
These four areas aim to lower technical barriers and attract more participants.
Additionally: - Strategic Product Development: Supporting high-impact products.
- Industry Demo Projects & Experience Centers: Funding flagship applications and user experience showcases.
- Technical Optimization: Rewarding performance enhancements achieving leading benchmarks.
- Market Expansion: Incentivizing significant market share gains.
These measures will accelerate end-to-end industrialization and scale. - Special Incentive: Test Instrument Development: Dedicated funding for tools meeting full test specifications.
The Alliance will provide substantial financial support to partners committed to these initiatives. Secretary-General Zeng called on developers to apply for "Developer Partner" status to access these resources.
Walking Hand-in-Hand with Developers
Building a Prosperous Spark Ecosystem
"Without accumulating small steps, one cannot journey a thousand miles; without gathering small streams, one cannot form a vast ocean," emphasized Secretary-General Zeng. "Each firm step by our developer partners propels the SparkLink ecosystem forward."
The International SparkLink Alliance has set ambitious 2025 goals:
- Enable 10+ industry applications
- Support 100+ chip/module types
- Certify 500+ commercial products
- Achieve 1 million lines of code contributions
Moving forward, the Alliance will:
- Build a vibrant developer community.
- Host technical workshops, developer contests, and flagship events.
- Deepen the "SparkLink Cup" university challenge.
- Strengthen the "Action" program.
Through enhanced benefits, richer incentives, and premium support, the Alliance pledges to empower developers comprehensively, partnering to create a thriving SparkLink ecosystem and share the dividends of the AI-connected era.Join the SparkLink ecosystem today and co-create the blueprint for an intelligently connected world!