News - bluetooth蓝牙技术

Bluetooth LE wearable gives musicians intuitive control of their performance

Genki Instruments’ Wave uses Nordic’s nRF52832 SoC to turn hand gestures into low latency wireless instrument control

Published in News and reports

Renesas:IoT Sensor Board with Machine Learning & Bluetooth® Low Energy

Written by Blue Star

This is a reference design for a versatile Internet of Things (IoT) sensor board solution. It targets applications in industrial predictive maintenance, smart home/IoT appliances with gesture recognition, wearables (activity tracking), and mobile for innovative human machine interface, or HMI, (FingerSense) solutions. This reference design was developed with Renesas partner Qeexo, who provided their Automated Machine Learning platform (AutoML) for edge devices.

Published in Bluetooth modules

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Ti SimpleLink™ CC2640R2L Flash-based wireless MCU

Connectivity overview

Expanded portfolio of wireless connectivity devices across scalable memory and performance options.

Arm® Cortex® architecture

32kB to 352KB flash memory

20kB to 80kB SRAM with pin-to-pin compatibility

Across wireless connectivity protocols

Supporting a broad range of Bluetooth® Coded PHY, 2MB PHY, Extended advertising, Bluetooth Low Energy 5.1,Locationing, Mesh, Multiprotocol

Quarterly SDK releases with latest Bluetooth Low Energy features

Scalable Scalablefeatures

Integrated sensor controller, precision ADC, PA, coexistence BAW resonator

Radio

• Power output: +5dBm

• -97dBm sensitivity

• Sofware configurable

Published in Bluetooth chips

Renesas Extends Bluetooth 5.0 Connectivity to RA Family of 32-Bit MCUs with Arm Cortex-M Core

Enhanced Security and Privacy for Bluetooth 5.0 Low Energy Connections Supported with Flexible Software Package and Comprehensive Arm Ecosystem.

Renesas Electronics Corporation introduced the first RA microcontroller (MCU) with an integrated Bluetooth® 5.0 Low Energy radio on 07 May 2020. The single-chip RA4W1 MCU includes a 48 MHz, 32-bit Arm® Cortex®-M4 core and Bluetooth 5.0 core delivered in a 56-pin QFN package. Together, the RA4W1 MCU and easy-to-use Flexible Software Package (FSP) enables engineers to immediately begin development with Arm ecosystem software and hardware building blocks that work out-of-the-box with RA MCUs.

The RA4W1 MCU makes it easy for embedded designers to develop safe and secure IoT endpoint devices for Industry 4.0, building automation, metering, healthcare, consumer wearable, and home appliance applications. The MCU is also ideal for developing IoT edge devices for wireless sensor networks, IoT hubs, an add-on to gateways, and an aggregator to IoT cloud applications.

Published in Bluetooth chips

Ti SimpleLink Bluetooth® Low Energy wireless MCUs

Written by Blue Star

Low-power wireless standard to easily connect any product to smartphones or tablets