• 恩智浦宣布推出首款支持6GHz频段的Wi-Fi 6E三频段片上系统(SoC),该频段将Wi-Fi可用频谱最高扩展1.2GHz
  • CW64专为接入点和服务提供商网关而设计,助力终端网络设备充分利用6GHz频谱
  • 恩智浦满足了客户对于更大无线网络容量的需求,能够以4.8Gbps的PHY速率和超过4Gbps的实际吞吐量,支持160-MHz的通道带宽
  • NXP announces its first Wi-Fi 6E Tri-Band system-on-chip (SoC) to support the 6GHz band that expands spectrum available for Wi-Fi by up to 1.2GHz.
  • The CW641 is designed for access points and service provider gateways to enable end network devices to take full advantage of the 6GHz spectrum.
  • NXP answers customer demands for greater capacity in wireless networking and supports 160-MHz channel bandwidth with PHY rates of 4.8Gbps and over 4Gbps of real-world throughput.
Samsung Galaxy S21 Ultra delivers unprecedented multi-gigabit, low-latency Wi-Fi leveraging the 6 GHz band
Low power Wi-Fi technology will make the smart home network a lot simpler by eliminating the need for an expensive hub and solving the issue of protocol fragmentation. Dialog is disrupting the smart home industry with its low power Wi-Fi technology. The DPM algorithms based on Dialog’s VirtualZero technology allow IoT devices to have a year of battery life or even more. This effectively makes Wi-Fi a great alternative to both Zigbee and Z-wave.
Dialog Semiconductor plc announced that its DA16200 SoC has scored 815 on the EEMBC IoTMark™-Wi-Fi benchmark. The DA16200’s achievement solidifies Dialog’s position as a leader in the ultra-low-power Wi-Fi networking SoC market.
Dialog Semiconductor’s First Combo Wi-Fi and BLE Module Points the Way for a New Wave of IoT Connectivity
Two-in-one module leverages the new DA16200 VirtualZero™ Wi-Fi technology with SmartBond™ TINY DA14531 Bluetooth for best-in-class battery life with ease of configurability
 
Because delivering connected devices shouldn’t be complex. No matter what device you’re working on, or what market you’re in.Let’s simplify Intelligence with Wi-Fi and Bluetooth.

 NXP wireless solutions build upon decades of Wi-Fi and Bluetooth silicon, system and software design expertise. NXP is committed to drive large-scale deployment across multiple markets by a broad array of power- and cost-optimized Wi-Fi and Bluetooth chipsets, enabling products with today’s most advanced Wi-Fi capabilities.